| 1. | Wafer process control system
芯片处理控制系统 |
| 2. | Wafer processing equipment
薄片加工装置 |
| 3. | Hundreds of systems are in use in wafer processing applications throughout the world
成千上百种系统广泛应用于全球晶片工艺过程 |
| 4. | The wafer processing system is an important subsystem of the lithography , which consists of a wafer transmission system and a wafer pre - alignment system
晶圆处理系统是光刻机的重要组成子系统,其包含两个主要部分:晶圆传输系统和晶圆预对准系统。 |
| 5. | A common distribution core that providesall electrical power , gases , chemicals , and other services to the sectors of an automated wafer processing system
一种公共分配中心，向自动化晶片处理系统中的各个部分提供所有的电源、气体、化学原料和其它服务。 |
| 6. | Our development team can complete the programme from the basic photovoltaic chip design , character simulation , territory design , wafer processing , testing , packaging , and device serialization services
我们的开发团队可以完成从基本的光电芯片方案设计、特性仿真、版图设计、晶元投片、测试、器件封装等系列化服务。 |
| 7. | We effectively solve the stress of wafer process and prove the function of the new slicing slurry and lapping slurry in wafer process . research fruit is applied to manufacture
在实验部分中我们有效地解决了硅片加工的应力问题，验证了新型切削液和研磨液在硅片加工过程中的明显作用，并使研究成果投入生产转化为产品。 |
| 8. | Upon its establishment tera xtal managed to recruit the top technical personnel in crystal growth and wafer processing fields . their first mission was to manufacture the lithium tantalate crystal substrate for the rf saw filters used in the wireless applications
凝聚国内长晶及晶圆加工等技术第一流菁英共同组成的经营团队投入创业，半年来最主要的课题就是在最短的时间内生产出无线通讯器材内射频表面声波滤波器 |
| 9. | There exist large stress , intensive scratch , damage and pollution of ion in wafer process , so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress . reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process
目前加工过程中存在应力过大，造成表面划伤严重，容易产生破损，离子沾污的问题，因而必须改善切削、研磨机理，把单一的机械作用变为均匀稳定的化学机械作用，以达到浅损伤、低应力的目的，有效的减少破损层和应力的累积，提高产品质量和加工的效率。 |
| 10. | Slicing , lapping , and edging all can lead to intensive stress and damage in wafer process because of too intensive and unbalanced mechanical action to wafer substrate , at last cumulating stress come into being . at present damage and stress has become the most important matter which affects quality and finished product ratio of wafer
在衬底加工过程中，切片、磨片、倒角等工序都会对硅片造成大的损伤和应力，这些都是因为在加工过程中机械作用过于强烈，而且不能均衡的作用在加工的硅片上，最终造成大的应力累积。 |
